31 CFR § 850.201 - Advanced packaging.

---
identifier: "/us/cfr/t31/s850.201"
source: "ecfr"
legal_status: "authoritative_unofficial"
title: "31 CFR § 850.201 - Advanced packaging."
title_number: 31
title_name: "Money and Finance: Treasury"
section_number: "850.201"
section_name: "Advanced packaging."
chapter_name: "OFFICE OF INVESTMENT SECURITY, DEPARTMENT OF THE TREASURY"
part_number: "850"
part_name: "PROVISIONS PERTAINING TO U.S. INVESTMENTS IN CERTAIN NATIONAL SECURITY TECHNOLOGIES AND PRODUCTS IN COUNTRIES OF CONCERN"
positive_law: false
currency: "2026-04-05"
last_updated: "2026-04-05"
format_version: "1.1.0"
generator: "[email protected]"
authority: "50 U.S.C. 1701  E.O. 14105, 88 FR 54867, 31 U.S.C. 321."
regulatory_source: "89 FR 90462, Nov. 15, 2024, unless otherwise noted."
cfr_part: "850"
---


# 850.201 Advanced packaging.

The term *advanced packaging* means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional (3D) assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.