31 CFR § 850.218 - Package.

---
identifier: "/us/cfr/t31/s850.218"
source: "ecfr"
legal_status: "authoritative_unofficial"
title: "31 CFR § 850.218 - Package."
title_number: 31
title_name: "Money and Finance: Treasury"
section_number: "850.218"
section_name: "Package."
chapter_name: "OFFICE OF INVESTMENT SECURITY, DEPARTMENT OF THE TREASURY"
part_number: "850"
part_name: "PROVISIONS PERTAINING TO U.S. INVESTMENTS IN CERTAIN NATIONAL SECURITY TECHNOLOGIES AND PRODUCTS IN COUNTRIES OF CONCERN"
positive_law: false
currency: "2026-04-05"
last_updated: "2026-04-05"
format_version: "1.1.0"
generator: "[email protected]"
authority: "50 U.S.C. 1701  E.O. 14105, 88 FR 54867, 31 U.S.C. 321."
regulatory_source: "89 FR 90462, Nov. 15, 2024, unless otherwise noted."
cfr_part: "850"
---


# 850.218 Package.

The term *package* means to assemble various components, such as the integrated circuit die, lead frames, interconnects, and substrate materials to safeguard the semiconductor device and provide electrical connections between different parts of the die.