15 CFR § 231.108 - Material expansion.
---
identifier: "/us/cfr/t15/s231.108"
source: "ecfr"
legal_status: "authoritative_unofficial"
title: "15 CFR § 231.108 - Material expansion."
title_number: 15
title_name: "Commerce and Foreign Trade"
section_number: "231.108"
section_name: "Material expansion."
chapter_name: "NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, DEPARTMENT OF COMMERCE"
subchapter_number: "C"
subchapter_name: "CHIPS PROGRAM"
part_number: "231"
part_name: "CLAWBACKS OF CHIPS FUNDING"
positive_law: false
currency: "2026-04-05"
last_updated: "2026-04-05"
format_version: "1.1.0"
generator: "[email protected]"
authority: "15 U.S.C. 4651,"
regulatory_source: "88 FR 61614, Sept. 25, 2023, unless otherwise noted."
cfr_part: "231"
---
# 231.108 Material expansion.
*Material expansion* means:
(1) with respect to an existing facility, the increase of the semiconductor manufacturing capacity of that facility by more than five percent of the capacity memorialized in the required agreement due to the addition of a cleanroom, production line or other physical space, or a series of such additions; or
(2) any construction of a new facility for semiconductor manufacturing.
[88 FR 89574, Dec. 28, 2023]