Title 15, Part 231 — Clawbacks of Chips Funding
37 sections
Section 231.101
Existing facility.
Section 231.102
Foreign country of concern.
Section 231.103
Foreign entity.
Section 231.104
Foreign entity of concern.
Section 231.105
Joint research.
Section 231.106
Knowingly.
Section 231.107
Legacy semiconductor.
Section 231.108
Material expansion.
Section 231.109
Members of the affiliated group.
Section 231.110
Person.
Section 231.111
Predominately serves the market.
Section 231.112
Required agreement.
Section 231.113
Research and development.
Section 231.114
Secretary.
Section 231.115
Semiconductor.
Section 231.116
Semiconductor manufacturing.
Section 231.117
Semiconductor manufacturing capacity.
Section 231.118
Semiconductors critical to national security.
Section 231.119
Significant renovations.
Section 231.120
231.120 Technology licensing.
Section 231.121
Technology or product that raises national security concerns.
Section 231.201
Scope.
Section 231.202
Prohibition on certain expansion transactions. (Expansion Clawback)
Section 231.203
Prohibition on certain joint research or technology licensing. (Technology Clawback)
Section 231.204
Additional conditions on certain joint research or technology licensing.
Section 231.205
Retention of records.
Section 231.301
Procedures for notifying the Secretary of significant transactions.
Section 231.302
Contents of notifications; certifications.
Section 231.303
Response to notifications.
Section 231.304
Initiation of review.
Section 231.305
Procedures for review.
Section 231.306
Mitigation of national security risks.
Section 231.307
Review of actions that may violate the prohibition on certain joint research or technology licensing.
Section 231.308
Recovery and other remedies.
Section 231.401
Amendment.
Section 231.402
Submission of false information.
Section 231.403
Severability.