15 CFR § 231.117 - Semiconductor manufacturing capacity.

---
identifier: "/us/cfr/t15/s231.117"
source: "ecfr"
legal_status: "authoritative_unofficial"
title: "15 CFR § 231.117 - Semiconductor manufacturing capacity."
title_number: 15
title_name: "Commerce and Foreign Trade"
section_number: "231.117"
section_name: "Semiconductor manufacturing capacity."
chapter_name: "NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, DEPARTMENT OF COMMERCE"
subchapter_number: "C"
subchapter_name: "CHIPS PROGRAM"
part_number: "231"
part_name: "CLAWBACKS OF CHIPS FUNDING"
positive_law: false
currency: "2026-04-05"
last_updated: "2026-04-05"
format_version: "1.1.0"
generator: "[email protected]"
authority: "15 U.S.C. 4651,"
regulatory_source: "88 FR 61614, Sept. 25, 2023, unless otherwise noted."
cfr_part: "231"
---


# 231.117 Semiconductor manufacturing capacity.

*Semiconductor manufacturing capacity* means the productive capacity of a facility for semiconductor manufacturing. In the case of a wafer production facility, semiconductor manufacturing capacity is measured in wafers per year. In the case of a semiconductor fabrication facility, semiconductor manufacturing capacity is measured in wafer starts per year. In the case of a semiconductor fabrication facility for wafers designed for wafer-to-wafer bonding structure, semiconductor manufacturing capacity is measured in stacked wafers per year. In the case of a packaging facility, semiconductor manufacturing capacity is measured in packages per year.